Thermal conductive properties of Ni–P electroless plated SiCp/Al composite electronic packaging material-Reference-Cited by-同舟云学术

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Thermal conductive properties of Ni–P electroless plated SiCp/Al composite electronic packaging material

Published:2008-03 Issue:12 Volume:202 Page:2540-2544
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Zhao H.F.,Tang W.Z.,Li C.M.,Chen G.C.,Lu F.X.,Cai Y.H.,Guo H.,Zhang R.Q.,Zhang P.W.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference21 articles.

1. Composites for electronic packaging and thermal management;Chung,2000

2. Materials for thermal conduction

3. A new electroless nickel deposition technique to metallise SiCp/Al composites

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4. Achieving high-efficiency electrically insulating ceramic layer formed on SiCp/Al composite by bipolar pulsed PEO for novel integrated strategy;Surface and Coatings Technology;2022-08

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