Effects of Cu and Cu/Ti interlayer on adhesion of diamond film-Reference-Cited by-同舟云学术

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Effects of Cu and Cu/Ti interlayer on adhesion of diamond film

Published:2007-11 Issue:1 Volume:202 Page:180-184
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Huang Yangfeng,Xiao Hanning,Ma Zhibin,Wang Jianhua,Gao Pengzhao

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference21 articles.

1. Application of diamond-coated cutting tools

2. Wear Characteristics of Diamond Tools in Machining Ceramics

3. CVD-diamond coatings in sliding contact with Al, Al-17Si and steel

4. Diamond synthesis on a metal substrate

5. Diffusion-modified boride interlayers for chemical vapour deposition of low-residual-stress diamond films on steel substrates

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3. Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer;Materials;2021-05-15

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5. Processing the Working Parts of Tools Used in Construction Industry Using High Energy Methods;Materials Science Forum;2020-05

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