A Co-based surface activator for electroless copper deposition-Reference-Cited by-同舟云学术

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A Co-based surface activator for electroless copper deposition

Published:2012-02 Issue:11-12 Volume:206 Page:2967-2971
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Naruškevičius L.,Tamašauskaitė-Tamašiūnaitė L.,Žielienė A.,Jasulaitienė V.

Funder

Research Council of Lithuania

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference23 articles.

1. Silver nanoparticle catalyst for electroless Ni deposition and the promotion of its adsorption onto PET substrate

2. Adsorption Promotion of Ag Nanoparticle Using Cationic Surfactants and Polyelectrolytes for Electroless Cu Plating Catalysts

3. Electrical properties of sub-100nm Cu films deposited by electroless plating on amino-terminated silicon oxide activated with Au nano-particles

4. Study of a pre-treatment process for electroless copper plating on ceramics

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation on electroless metallized fused filament fabricated ABS parts;Materials and Manufacturing Processes;2022-12-19

2. A generalized sample preparation method by incorporation of metal–organic compounds into polymers for electroless metallization;Journal of Applied Polymer Science;2020-11-10

3. Facile Synthesis of CuO–Ni/Al Composites for Catalytic Oxidation of Cyclohexene;Catalysis Letters;2019-02-28

4. Performance analysis of a thick copper-electroplated FDM ABS plastic rapid tool EDM electrode;Advances in Manufacturing;2018-11-23

5. Environmental friendly electroless copper metallization on FDM build ABS parts;International Journal of Plastics Technology;2017-10-31

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