Electrodeposition of nano-diamond/copper composite platings: Improved interfacial adhesion between diamond and copper via formation of silicon carbide on diamond surface-Reference-Cited by-同舟云学术

Electrodeposition of nano-diamond/copper composite platings: Improved interfacial adhesion between diamond and copper via formation of silicon carbide on diamond surface

Published:2020-12 Issue: Volume:403 Page:126322
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Hagio Takeshi^ORCID,Park Jae-Hyeok^ORCID,Naruse Yuto,Goto Yasuki,Kamimoto Yuki,Ichino Ryoichi,Bessho Takeshi

Funder

Japan Science and Technology Agency

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

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