Target poisoning during reactive magnetron sputtering: Part II: the influence of chemisorption and gettering-Reference-Cited by-同舟云学术

Target poisoning during reactive magnetron sputtering: Part II: the influence of chemisorption and gettering

Published:2004-05 Issue:2-3 Volume:183 Page:190-195
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Depla D.,De Gryse R.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference9 articles.

1. Modeling of reactive sputtering of compound materials

2. Influence of oxygen addition on the target voltage during reactive sputtering of aluminium

3. Target voltage behaviour during DC sputtering of silicon in an argon/nitrogen mixture

4. J.F. Ziegler, J.P. Biersack, L. Littmark, The stopping and Range of Ions in Solids, Pergamon, New york, 1985, SRIM can be downloaded from http://www.srim.org

5. Cross section for removing chemisorbed oxygen from an aluminum target by sputtering

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