1. JEDEC Design Standard, Design requirements for outlines of solid state and related products, JEDEC Standard No. 95-1, Section 14, ball grid array, June 2000.
2. T2-BGA thermal performance;Chen;Surf. Mount Technol.,1999
3. Novel package with thermally and electrically enhanced PBGA—T2-BGA;Chen;Ind. Mater.,1998
4. D. Liang, Warpage study of glob top cavity-up EPBGA packages, in: Proceedings of the IEEE Electronics Components Technology Conference, Orlando, FL, 1996, pp. 694–701.
5. Application of the Taguchi method on the robust design of molded 225 plastic ball grid array packages;Metrol;IEEE Trans. Components Packag. Manuf. Technol.-Part B,1995