Leaching of cuprite with ozone as an oxidant in sulfuric acid solution and its oxidation leaching mechanism
Author:
Publisher
Elsevier BV
Subject
General Chemical Engineering,General Chemistry
Reference42 articles.
1. PMo12@UiO-67 nanocomposite as a novel non-leaching catalyst with enhanced performance durability for sulfur removal from liquid fuels with exceptionally diluted oxidant;Abazari;Appl. Catal. B Environ.,2021
2. Leaching kinetics of Cu, Ni and Zn from waste silica rich integrated circuits using mild nitric acid;Ajiboye;Hydrometallurgy,2019
3. Evaluation of ozone-based oxidation and solar advanced oxidation treatment of greywater;Alrousan;J. Environ. Chem. Eng.,2020
4. Leaching of cuprite through NH4OH in basic systems;Aracena;T. Nonferr. Metal. Soc.,2018
5. Passivation improvement of nitric acid oxide by ozone post-treatment for tunnel oxide passivated contacts silicon solar cells;Baek;Appl. Surf. Sci.,2019
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1. Experimental and DFT studies on using Fenton reagent as oxidant to enhance the leaching of cuprite in sulfuric acid system;Separation and Purification Technology;2025-02
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