Fatigue life estimations of solid-state drives with dummy solder balls under vibration-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Fatigue life estimations of solid-state drives with dummy solder balls under vibration

Published:2016-07 Issue: Volume:88 Page:42-48
ISSN:0142-1123
Container-title:International Journal of Fatigue
language:en
Short-container-title:International Journal of Fatigue

Author:

Jang Jinwoo,Jang Gunhee,Lee Juyub,Cho Yeungjung,Cinar Yusuf

Funder

Hanyang University

Samsung Electronics Co. Ltd.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,Modeling and Simulation

Reference23 articles.

1. Vibration analysis for electronic equipment;Steinberg,2000

2. JEDEC standard for vibration: JESD22-B103B,2002

3. Effect of corrosion on the low cycle fatigue behavior of Sn–4.0 Ag–0.5 Cu lead-free solder joints;Andersson;Int J Fatigue,2008

4. Low cycle fatigue study of lead free 99.3 Sn–0.7 Cu solder alloy;Pang;Int J Fatigue,2004

5. Low cycle fatigue test for solders using non-contact digital image measurement system;Kanchanomai;Int J Fatigue,2002

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A review of extreme condition effects on solder joint reliability: Understanding failure mechanisms;Defence Technology;2024-05

2. Concept for a simulation-based reliability assessment at the system level of printed circuit boards;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

3. Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration;Materials;2024-02-04

4. Prognostics and Health Management Using Nonlinear Cumulative Damage Model for Electronic Devices Under Variable Loading;IEEE Access;2024

5. Effect of boundary conditions on fatigue life of board-level BGA solder joints under random vibration;Microsystem Technologies;2023-09-30

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3