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Fatigue crack propagation in a copper/epoxy molding compound interface as impacted by mode-mixity

  • Published:2019-08 Issue: Volume:125 Page:161-169
  • ISSN:0142-1123
  • Container-title:International Journal of Fatigue
  • language:en
  • Short-container-title:International Journal of Fatigue

Author:

Samet DavidORCID,Taylor Christine,Trilochan Rambhatla V.N.N.,Sitaraman Suresh K.

Funder

Semiconductor Research CorporationSemiconductor Research Corporation (SRC)

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,Modeling and Simulation

Reference37 articles.

1. Interfacial fracture toughness for delamination growth prediction in a novel peripheral away package;Sundararaman;IEEE Trans Compon Packag Technol,2001

2. A modified mixed-mode bending specimen for the interfacial fracture testing of dissimilar materials;Soboyejo;Fatigue Fract Eng Mater Struct,1999

3. Numerical modeling of interfacial delamination propagation in a novel peripheral array package;Harries;IEEE Trans Compon Packag Technol,2001

4. Experiments for obtaining cohesive-zone parameters for copper-mold compound interfacial delamination;Krieger;IEEE Trans Compon Packag Manuf Technol,2016

5. A method for evaluating delamination between epoxy moulding compounds and different plated leadframes;Lam,2000

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Crowbar Loading-A New Test Technique to Characterize Interfacial Delamination;Engineering Fracture Mechanics;2023-04

2. Magnetic-Based Interfacial Adhesion Measurement Technique with Environmental Conditions;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. Magnetically Actuated Test Method for Interfacial Fracture Reliability Assessment;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

4. Effect of temperature and humidity conditioning on copper leadframe/mold compound interfacial delamination;Microelectronics Reliability;2020-08
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