Load-dependency of damage process in tension-compression fatigue of microscale single-crystal copper
Author:
Funder
JSPS KAKENHI
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,Modeling and Simulation
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1. Dislocation structures in micron-sized Ni single crystals produced via tension–compression cyclic loading;Acta Materialia;2024-09
2. Unique damage process in micro-sized copper single crystal with double-slip orientation in response to near-[112] tension-compression fatigue;Materials Science and Engineering: A;2024-09
3. Characteristic fatigue damage near the Σ3(111) coherent twin boundary in micron-sized copper specimen;Materials Science and Engineering: A;2024-05
4. Surface outflow effect on dislocation structures in micrometer-sized metals;Extreme Mechanics Letters;2023-12
5. Artificial Neural Network for the Prediction of Fatigue Life of Microscale Single-Crystal Copper;Crystals;2023-03-21
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