Measurement-driven, model-based estimation of residual stress and its effects on fatigue crack growth. Part 1: Validation of an eigenstrain model
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,Modeling and Simulation
Reference40 articles.
1. 50th anniversary article: the origin and management of residual stress in heat-treatable aluminium alloys;Robinson;Strain,2014
2. Y, Altschuler T, Kaatz B, Cina Relief of Residual Stresses in a High-Strength Aluminum Alloy by Cold Working. Mech Relax Residual Stress 1988;STP993-EB:19–29.
3. Residual stress, stress relief, and inhomogeneity in aluminum plate;Prime;Scr Mater,2002
4. Prime MB, Newborn MA, Balog JA. Quenching and Cold-Work Residual Stresses in Aluminum Hand Forgings: Contour Method Measurement and FEM Prediction. THERMEC’2003 Process. Manuf. Adv. Mater., vol. 426–432, Leganés, Madrid, Spain: Trans Tech Publications; 2003, p. 435–40. doi:10.4028/www.scientific.net/MSF.426-432.435.
5. Assessment of residual stress of 7050–T7452 aluminum alloy forging using the contour method;Zhang;Mater Sci Eng A,2015
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2. Factors Influencing Residual Stresses in Cold Expansion and Their Effects on Fatigue Life—A Review;Coatings;2023-12-02
3. Measurement-driven, model-based estimation of residual stress and its effects on fatigue crack growth. Part 2: Fatigue crack growth testing and modeling;International Journal of Fatigue;2022-10
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