Possibility of and conditions for the room temperature formation of compounds at the bulk metal/thin metal film interface-Reference-Cited by-同舟云学术

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Possibility of and conditions for the room temperature formation of compounds at the bulk metal/thin metal film interface

Published:1983-12 Issue:2 Volume:95 Page:259-265
ISSN:0022-5088
Container-title:Journal of the Less Common Metals
language:en
Short-container-title:Journal of the Less Common Metals

Author:

Simić V.,Marinković Ž.

Publisher

Elsevier BV

Subject

General Engineering

Reference4 articles.

1. Diffusion in evaporated films of gold—lead

2. Room temperature interactions in Ag-metals thin film couples

3. Room temperature interactions in Au/metal and Al/metal thin film couples

4. Room temperature interactions in copper-metal thin film couples

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1. Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength;Journal of Electronic Materials;2016-05-13

2. Solvated Metal Atom Dispersion (SMAD) for Making Metal Nanoparticles;Nanochemistry;2013

3. Room-temperature reactions in thin metal couples;Journal of Materials Science;1998

4. First phase formation at interfaces: Comparison between Walser-Bené and effective heat of formation model;Materials Chemistry and Physics;1996-11

5. Room temperature formation and stability of compounds in metal couples of bulk-film type;Thin Solid Films;1994-09

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