In situ fabrication of Ni3S2/Cu2S heterojunction on nickel foam as a highly efficient and durable electrocatalyst for overall water splitting
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Published:2024-09
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ISSN:0021-9797
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Container-title:Journal of Colloid and Interface Science
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language:en
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Short-container-title:Journal of Colloid and Interface Science
Author:
Zhang Siqi,
Yao Huiqin,
Deng Ruxin,
Zhan Jiayi,
Tong Tian,
Wang Yixuan,
Yan Haiqing,
Wang Chaonan,
Li Cheng,
Dong Hongliang,
Ma ShulanORCID