A quasi-three-dimensional distributed parameter model of micro-channel separated heat pipe applied for cooling telecommunication cabinets-Reference-Cited by-同舟云学术

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A quasi-three-dimensional distributed parameter model of micro-channel separated heat pipe applied for cooling telecommunication cabinets

Published:2020-10 Issue: Volume:276 Page:115544
ISSN:0306-2619
Container-title:Applied Energy
language:en
Short-container-title:Applied Energy

Author:

Xia Guanghui,Zhuang Dawei,Ding Guoliang,Lu Jingchao

Funder

National Nature Science Foundation of China

National Science Foundation of China

National Natural Science Foundation of China

SJTU

Special Fund of Jiangsu Province for the Transformation of Scientific and Technological Achievements

Publisher

Elsevier BV

Subject

Management, Monitoring, Policy and Law,Mechanical Engineering,General Energy,Building and Construction

Reference49 articles.

1. Simulation on the performance and free cooling potential of the thermosyphon mode in an integrated system of mechanical refrigeration and thermosyphon;Zhang;Appl Energy,2017

2. Cooling energy-hungry data centers;Meijer;Science,2010

3. Technological drivers in data centers and telecom systems: Multiscale thermal, electrical, and energy management;Garimella;Appl Energy,2013

4. Energy-saving analysis of telecommunication base station with thermosyphon heat exchanger;Zhou;Energ Build,2013

5. Thermo-economic analysis of steady state waste heat recovery in data centers using absorption refrigeration;Ebrahimi;Appl Energy,2015

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1. Flow characteristics and heat transfer performance in tubes with dimples-protrusions;Case Studies in Thermal Engineering;2024-09

2. Investigation on performance enhancement of micro-channel separated heat pipe in data center: A coupled heat-mass-flow characterization approach;Applied Thermal Engineering;2024-07

3. Predicting evaporation heat transfer coefficient distribution in multi-path alternating-laminated-microchannel-tube (ALMT) heat exchanger based on infrared thermography;Applied Energy;2024-06

4. A comprehensive review on microchannel heat sinks for electronics cooling;International Journal of Extreme Manufacturing;2024-01-11

5. Experimental investigation on the heat transfer performance of a microchannel thermosiphon array for 5G telecommunication base stations;Applied Thermal Engineering;2024-01

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