High performance of Bi2Te3-based thermoelectric generator owing to pressure in fabrication process-Reference-Cited by-同舟云学术

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High performance of Bi2Te3-based thermoelectric generator owing to pressure in fabrication process

Published:2022-11 Issue: Volume:326 Page:119959
ISSN:0306-2619
Container-title:Applied Energy
language:en
Short-container-title:Applied Energy

Author:

Xu Haowei,Zhang Qiang,Yi Longbing,Huang Shaolin,Yang Hao,Li Yanan,Guo Zhe,Hu Haoyang,Sun Peng,Tan Xiaojian,Liu Guo-qiang,Song Kun,Jiang Jun

Publisher

Elsevier BV

Subject

Management, Monitoring, Policy and Law,Mechanical Engineering,General Energy,Building and Construction

Reference31 articles.

1. Harvesting low-grade heat energy using thermo-osmotic vapour transport through nanoporous membranes;Straub;Nat Energy,2016

2. Thermoelectric materials and heat exchangers for power generation – a review;Patil;Renew Sustain Energy Rev,2018

3. Modeling, experimental study and optimization on low-temperature waste heat thermoelectric generator system;Gou;Appl Energy,2010

4. Optimization of cross flow heat exchangers for thermoelectric waste heat recovery;Crane;Energy Convers Manage,2004

5. Rationally designing high-performance bulk thermoelectric materials;Tan;Chem Rev,2016

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cellulose-based thermoelectric composites: A review on mechanism, strategies and applications;International Journal of Biological Macromolecules;2024-08

2. Realizing high-efficiency thermoelectric module by suppressing donor-like effect and improving preferred orientation in n-type Bi2(Te, Se)3;Science Bulletin;2024-06

3. Enhancing Bi2Te2.70Se0.30 Thermoelectric Module Performance through COMSOL Simulations;Thermo;2024-05-06

4. Effect of heat dissipation on the performance of thermoelectric generator;Applied Thermal Engineering;2024-05

5. Improved contact performance and thermal stability of Co–Ni alloy barrier layer for bismuth telluride-based thermoelectric devices;Journal of Materials Science: Materials in Electronics;2024-04

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