Microstructure development in the directionally solidified Al–4.0 wt% Cu alloy system-Reference-Cited by-同舟云学术

Microstructure development in the directionally solidified Al–4.0 wt% Cu alloy system

Published:2001-01 Issue:1 Volume:2 Page:309-320
ISSN:1468-6996
Container-title:Science and Technology of Advanced Materials
language:en
Short-container-title:Science and Technology of Advanced Materials

Author:

Trivedi R.¹,Liu S.¹,Mazumder P.¹,Simsek E.¹

Affiliation:

1. Ames Laboratory, Department of Materials Science and Engineering, US Department of Energy, Iowa State University, 100 Wilhelm Hall, Ames, IA, 50011-3020, USA

Publisher

Informa UK Limited

Subject

General Materials Science

Link

https://www.tandfonline.com/doi/pdf/10.1016/S1468-6996%2801%2900062-6

Reference22 articles.

1. Stability of a Planar Interface During Solidification of a Dilute Binary Alloy

2. Phase-field method for computationally efficient modeling of solidification with arbitrary interface kinetics

3. Numerical modeling of cellular/dendritic array growth: spacing and structure predictions

4. Natural convection in the hale-shaw cell of horizontal bridgman solidification

Cited by 48 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of High-Temperature Annealing on the Cross-Tension Property of Resistance Spot Welded Medium-Mn Steel;Archives of Metallurgy and Materials;2023-07-26

2. Influence of macroscopic interface curvature on dendritic patterns during directional solidification of bulk samples: Experimental and phase-field studies;Acta Materialia;2023-05

3. Theory and Practice of Using Pulsed Electromagnetic Processing of Metal Melts;Materials;2022-02-07

4. Effects of high static magnetic field on the microstructure of Zn-Bi monotectic alloys during directional solidification process;Journal of Alloys and Compounds;2021-12

5. Growth velocity and microhardness dependences of intermetallic compound phases on solubility range during peritectic solidification;Journal of Alloys and Compounds;2021-06