Effects of crosshead speeds on solder strength of Cu/Sn–9Zn/Cu lap joints

Author:

Affendy Muhammad Ghaddafy,Mohamad Ahmad Azmin

Funder

USM-RUI

Publisher

Elsevier BV

Subject

General Engineering

Reference25 articles.

1. Effects of corrosion on the shear strength of Cu/Sn–9Zn/Cu lap joints in 3.5wt.% NaCl solution;Affendy;Int. J. Electrochem. Sci.,2012

2. Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy;Ahmed;Microelectron. Reliab.,2010

3. Effect of bismuth and silver on the corrosion behavior of Sn–9Zn alloy in NaCl 3wt.% solution;Ahmido;Mater. Sci. Eng., B,2011

4. High solder joint reliability with lead free solders. Electronic components and technology conference;Amagai;IEEE,2003

5. Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn–9Zn binary eutectic solder alloy;Das;J. Alloy. Compd.,2009

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