Experimental and numerical study of the effect of silica filler on the tensile strength of a 3D-printed particulate nanocomposite
Author:
Publisher
Elsevier BV
Subject
Mechanics of Materials,General Materials Science
Reference28 articles.
1. Effect of particle size on the properties of Mg(OH)2-filled rubber composites;Zhang;J. Appl. Polym. Sci.,2004
2. Volume strain measurements on CACO3/polypropylene particulate composites: the effect of particle size;Lazzeri;J. Appl. Polym. Sci.,2004
3. Effect of particle size on mechanical properties of epoxy resin filled with angular-shaped silica;Nakamura;J. Appl. Polym. Sci.,1992
4. Tensile modulus of polymer nanocomposites;Ling Ji,2002
5. Studies on characterization of nano CaCO3 prepared by the in situ deposition technique and its application in PP-nano CaCO3 composites;Mishra;J. Polym. Sci., Part B, Polym. Phys.,2005
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