New phenomena concerning the effect of imperfect bonding on radial matrix cracking in fiber composites
Author:
Publisher
Elsevier BV
Subject
General Engineering,Mechanics of Materials,General Materials Science,Mechanical Engineering
Reference27 articles.
1. Damage in composite-modeling of imperfect bounding;Aboudi;Compos. Sci. Tech.,1987
2. Effect of interfacial zone on mechanical behavior and failure of fiber-reinforced composites;Achenbach;J. Mech. Phys. Solids,1989
3. Effect of interphases on micro and macromechanical behavior of hexageonal-array fiber composites;Achenbach;ASME J. Appl. Mech.,1990
4. The interaction between a crack and an inclusion;Atkinson;Int. J. Eng. Sci.,1972
5. On the effect of debonding on the overall behavior of composite materials;Benveniste;Mech. Mater.,1984
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