High toughness plant oil-based epoxy resins simultaneous with low dielectric properties
Author:
Publisher
Elsevier BV
Subject
Agronomy and Crop Science
Reference46 articles.
1. Identification of the reaction mechanism between phenyl methacrylate and epoxy and its application in preparing low-dielectric epoxy thermosets with flexibility;Chen;Polymer,2018
2. High-T-g, low-dielectric epoxy thermosets derived from methacrylate-containing polyimides;Chen;Polymers,2018
3. The reaction of activated esters with epoxides for self-curable, highly flexible, A(2)B(2)- and A(3)B(3)-type epoxy compounds;Chen;Polym. Chem.,2019
4. A facile strategy to achieve fully bio-based epoxy thermosets from eugenol;Chen;Green. Chem.,2019
5. A low-dielectric polymer derived from a biorenewable phenol (Eugenol);Chen;Acs Sustain. Chem. Eng.,2018
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A bio-based low dielectric polymer at high frequency derived from paeonol;Progress in Organic Coatings;2024-11
2. A dual cross-linking strategy enables fully bio-based epoxy thermosets with superior low dielectric properties and mechanical properties;Industrial Crops and Products;2024-11
3. Epoxy composite films of superior dielectric properties promoted by active ester hardeners for applications in electronic packaging;European Polymer Journal;2024-11
4. Siloxane-containing epoxy resins derived from magnolol with low dielectric properties, excellent toughness, and flame retardancy;Polymer;2024-10
5. Green bio-derived epoxidized linseed-oil plasticizer improves the toughness, strength, and dimensional stability of furfuryl alcohol-modified wood;Industrial Crops and Products;2024-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3