Thermal breakdown in solid dielectrics: A new approach-Reference-Cited by-同舟云学术

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Thermal breakdown in solid dielectrics: A new approach

Published:1998-05 Issue:4 Volume:335 Page:617-621
ISSN:0016-0032
Container-title:Journal of the Franklin Institute
language:en
Short-container-title:Journal of the Franklin Institute

Author:

Danikas M.G.,Papaschinopoulos G.

Publisher

Elsevier BV

Subject

Applied Mathematics,Computer Networks and Communications,Signal Processing,Control and Systems Engineering

Reference6 articles.

1. High Voltage Engineering Fundamentals;Kuffel,1984

2. Breakdown in solid dielectrics;O'Dwyer;IEEE Transactions Electrical Insulation,1982

3. Dielectric breakdown in perspex;Watson;IEEE Transactions Electrical Insulation,1973

4. Breakdown in solids;Cooper,1983

5. Elektrische Isoliertechnik;Kahle,1988

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Excellent plasma electrolytic oxidation coating on AZ61 magnesium alloy under ordinal discharge mode;Journal of Magnesium and Alloys;2021-02

2. Application of a polymer nanocomposite with carbon filler to limit overvoltages in a photovoltaic element;Journal of Advanced Dielectrics;2020-09-28

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