Cold plasma treatment on starch foam reinforced with wood fiber for its surface hydrophobicity
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Polymers and Plastics,Organic Chemistry
Reference16 articles.
1. Starch-based biodegradable materials suitable for thermoforming packaging;Avérous;Starch/Stärke,2002
2. Cold plasma treatment of polypropylene surface: A study on wettability and adhesion;Carrinoa;Journal of Materials Processing Technology,2002
3. Surface modification of polysaccharides under cold plasma conditions;Denes,1998
4. In situ lamination of starch-based baked foam packaging with degradable films;Glenn;Packaging Technology and Science,2007
5. Fluorocarbon barriers on starch foam tray surfaces through SF6 cold plasma treatment;Han;Composite Interfaces,2010
Cited by 36 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Superhydrophobicity of direct plasma synthesized and deposited thin films: Effect of chemical-induced and substrate roughness;Applied Surface Science;2024-06
2. Liquid uptake in porous cellulose sheets studied with UFI-NMR: Penetration, swelling and air displacement;Carbohydrate Polymers;2024-02
3. Wettability, Drug Delivery, Biodegradability, and Mechanical Strength of Chitosan–Gelatin Polymer Hydrogels Treated with Atmospheric Pressure DBD Plasma;High Energy Chemistry;2023-11-30
4. Effects of Various Types of Vacuum Cold Plasma Treatment on the Chemical and Functional Properties of Whey Protein Isolate with a Focus on Interfacial Properties;Colloids and Interfaces;2023-08-04
5. The Facile and Efficient Fabrication of Rice Husk/poly (lactic acid) Foam Composites by Coordinated the Interface Combination and Bubble Hole Structure;International Journal of Biological Macromolecules;2023-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3