Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature-Reference-Cited by-同舟云学术

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Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature

Published:2011-08 Issue:8 Volume:27 Page:673-679
ISSN:1005-0302
Container-title:Journal of Materials Science & Technology
language:en
Short-container-title:Journal of Materials Science & Technology

Author:

Yan F.,Zhang H.W.,Tao N.R.,Lu K.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Polymers and Plastics,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

Reference34 articles.

1. Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures

2. Nucleation and thickening of shear bands in nano-scale twin/matrix lamellae of a Cu–Al alloy processed by dynamic plastic deformation

3. High density nano-scale twins in Cu induced by dynamic plastic deformation

4. Effect of the Zener–Hollomon parameter on the microstructures and mechanical properties of Cu subjected to plastic deformation

5. A simple method for determining orientation and misorientation of the cubic crystal specimen

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