Electrospun antimicrobial materials: Advanced packaging materials for food applications-Reference-Cited by-同舟云学术

Electrospun antimicrobial materials: Advanced packaging materials for food applications

Published:2021-05 Issue: Volume:111 Page:520-533
ISSN:0924-2244
Container-title:Trends in Food Science & Technology
language:en
Short-container-title:Trends in Food Science & Technology

Author:

Hemmati Fatemeh,Bahrami Akbar,Esfanjani Afshin Faridi,Hosseini Hedayat^ORCID,McClements David Julian^ORCID,Williams Leonard

Publisher

Elsevier BV

Subject

Food Science,Biotechnology

Reference122 articles.

1. Antimicrobial effects of some herbal plants and spices on Staphylococcus epidermidis and Pseudomonas aeruginosa;ghara gheshlagh Alireza;International Journal of Food and Nutrition Science,2018

2. Electrospun antimicrobial hybrid mats: Innovative packaging material for meat and meat-products;Amna;Journal of Food Science and Technology,2015

3. Phytochemical analysis and evaluation of the antioxidant and antimicrobial properties of selected herbs cultivated in Greece;Anastasaki;Industrial Crops and Products,2017

4. Antimicrobial electrospun ultrafine fibers from zein containing eucalyptus essential oil/cyclodextrin inclusion complex;Antunes;International Journal of Biological Macromolecules,2017

5. Electrospun essential oil-doped chitosan/poly (ε-caprolactone) hybrid nanofibrous mats for antimicrobial food biopackaging exploits;Ardekani-Zadeh;Carbohydrate Polymers,2019

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