Author:
Riege Stefan P.,Thompson Carl V.
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference22 articles.
1. D. Edelstein, J. Heidenreich, R. Goldblatt, W. Cote, C. Uzoh, N. Lustig, P. Roper, T. McDevitt, W. Motsiff, A. Simon, J. Dukovic, R. Wachnik, H. Rathore, R. Schulz, L. Su, S. Luce, and J. Slattery, IEEE Int. Electron Devices Meeting Dig. 773 (1997).
2. The Role of Texture On The Reliability Of Aluminum Based Interconnects
3. K. Abe, Y. Harada, and H. Onada, In Proceedings of the 36th International Reliability Physics Symposium, p. 342 (1998).
4. Recrystallization kinetics of electroplated Cu in damascene trenches at room temperature
5. Texture Effects on the Electromigration Behavior of Layered Ti/AlCu/Ti Films
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