Organic package substrate embedded coupled magnetic core inductors using lithographic via technology for power supply in package
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Published:2024-05
Issue:
Volume:60
Page:107628
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ISSN:2211-3797
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Container-title:Results in Physics
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language:en
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Short-container-title:Results in Physics
Author:
Zhang Weihao,
Zhou GuoyunORCID,
Hong Yan,
Chen Xianming,
Huang Benxia,
Xu Xiaowei,
Ding Shuai,
Zhu Zhaojun,
Huang Yongmao,
He Wei