Thermo-mechanical modeling of thermal stress during multi-cycle intense pulsed light sintering of thick conductive wires on 3D printed dark substrate

Author:

Li Xin,Lei Ming,Mu Quanyi,Ren Keliang

Funder

National Natural Science Foundation of China

Key Research and Development Program of Hunan Province of China

Key Research and Development Program of Ningxia

Publisher

Elsevier BV

Subject

General Physics and Astronomy

Reference42 articles.

1. Roll-to-roll reverse-offset printing combined with photonic sintering process for highly conductive ultrafine patterns;Zhong;Adv Eng Mater,2020

2. The m4 3D Printer: A multi-material multi-method additive manufacturing platform for future 3D printed structures;Roach;Addit Manuf,2019

3. Potential for multi-functional additive manufacturing using pulsed photonic sintering;Das;Procedia Manuf,2015

4. Flash light assisted additive manufacturing of 3D structural electronics (FLAME);Jahangir;J Manuf Process,2022

5. 3D-printed conformal array patch antenna using a five-axes motion printing system and flash light sintering, 3D Print Addit;Meng;Manuf,2018

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