The diffusion behaviors at the Cu-Al solid-liquid interface: A molecular dynamics study-Reference-Cited by-同舟云学术

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The diffusion behaviors at the Cu-Al solid-liquid interface: A molecular dynamics study

Published:2020-03 Issue: Volume:16 Page:102998
ISSN:2211-3797
Container-title:Results in Physics
language:en
Short-container-title:Results in Physics

Author:

Mao Aixia,Zhang Jinping,Yao Shichang,Wang Aiqin,Wang Wenyan,Li Yan,Qiao Chong,Xie Jingpei,Jia Yu

Funder

National Natural Science Foundation

Foundation of Henan Educational Committee

Publisher

Elsevier BV

Subject

General Physics and Astronomy

Reference26 articles.

1. Study of the microstructure resulting from brazed aluminium materials used in heat exchangers;LaCaze;Mater Sci Eng A,2005

2. Calculation of alloy solid-liquid interfacial free energies from atomic-scale simulations;Asta;Phys Rev B,2002

3. Precursor film controlled wetting of Pb on Cu;Webb;Phys Rev Lett,2003

4. Molecular dynamics study of equilibrium concentration profiles and the gradient energy coefficient in Cu-Pb nanodroplets;Hoyt;Phys Rev B,2007

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