Transient thermal simulations of a three-dimensional unit cell in power control systems and high-power microwave devices

Author:

Buot F.A,Mittereder J.A,Anderson W.T,Ioannou D.E

Publisher

Elsevier BV

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. Electrothermal modeling of IGBTs: application to short-circuit conditions;Ammous;IEEE Trans Power Electron,2000

2. Yamashita Y, Uenishi A, Tomomatsu Y, Haraguchi H, Takahashi H, Takata I, Hagino H. A study on short circuit destruction of IGBTs. Proceedings of the 5th International Symposium on Power Semiconductor Devices and ICs. 1993. p. 35–40

3. Baliga BJ. Power semiconductor devices. Boston: PWS Publishing; 1996. p. 416

4. Baliga BJ, Chang HR, Chow TP, Al-Marayati S. New cell designs for improved IGBT safe-operating area. IEDM-88 1988. p. 809–12

5. Mittereder JA, Roussos JA, Anderson WT, Ioannou DE. A novel method for quantitatively measuring the channel temperature of GaAs devices for reliability lifetime prediction. IEEE Trans Reliab [December 2001 issue]

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