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Electrical characterization and structure investigation of quad flat non-lead package for RFIC applications

  • Published:2003-02 Issue:2 Volume:47 Page:315-322
  • ISSN:0038-1101
  • Container-title:Solid-State Electronics
  • language:en
  • Short-container-title:Solid-State Electronics

Author:

Chen Nansen,Chiang Kevin,Her T.D,Lai Yeong-Lin,Chen Chichyang

Publisher

Elsevier BV

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. Product manual. Siliconware Precision Industries Co., Ltd., 2001

2. Harvey P, Kinningham A, Schmolze C. Electrical characterization of tape ball grid array package. IEPS Conference, September 1995

3. Advanced measurement techniques for generation of SPICE models of RFIC packages;Horng;IEE Electron. Lett.,1999

4. Electrical characterization of metal enhanced BGA packages;Solomon;IEEE ECTC,1999

5. Fraser D, Bell OC, Strouth CT. Electrical characterization of ball grid array packages. High-performance System Design Conference, 1996

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