A hybrid approach for identification of root causes and reliability improvement of a die bonding process—a case study

Author:

Li Han-Xiong,Zuo Ming J

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Safety, Risk, Reliability and Quality

Reference7 articles.

1. Neave HR, Detoro IJ. Total Quality Management: Three Steps to Continuous Improvement. Reading: Addison-Wesley, 1990.

2. Morris D, Brandon J. Re-engineering Your Business. New Yrork: McGraw-Hill, 1993.

3. Imai MK. The Key to Japan's Competitive Success. New York: Random House, 1986.

4. The use of FMEA in process quality improvement;Janakiram;International Journal of Reliability, Quality and Safety Engineering,1995

5. Package styles drive advancements in die bonding;Baliga;Semiconductor International,1997

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