Author:
Zheng Zeyu,Xu Hui,Wen Jialin,Chen JiFeng,Mao Zhu,Zhu Pengli,Sun Rong,Wu Weijing,Peng Junbiao
Subject
Electrical and Electronic Engineering,Materials Chemistry,Mechanical Engineering,General Chemistry,Electronic, Optical and Magnetic Materials
Reference39 articles.
1. The semiconductor industry will soon abandon its pursuit of Moors’s law. Now things could get a lot more interesting;Waldrop;Nature,2016
2. Wide-bandgap-based power devices: reshaping the power electronics landscape;Bindra;IEEE Power Electron.,2015
3. Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging;Li;Mater. Today Phys.,2022
4. Managing heat for electronics;Schelling;Mater. Today,2005
5. High-temperature encapsulation materials for power modules: technology and future development trends;Gao;IEEE T Comp. Pack. Man.,2022
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