Laser slicing of a diamond at the {100} plane using an irradiation sequence that restricts crack propagation along the {111} plane
-
Published:2023-06
Issue:
Volume:136
Page:110045
-
ISSN:0925-9635
-
Container-title:Diamond and Related Materials
-
language:en
-
Short-container-title:Diamond and Related Materials
Author:
Sakamoto Kosuke,Tokunaga Daijiro,Itoh Sho,Hidai Hirofumi,Matsusaka Souta,Omatsu Takashige,Koyama Koji,Kim Seong-Woo,Morita Noboru
Funder
Machine Tool Engineering Foundation
Japan Society for the Promotion of Science
New Energy and Industrial Technology Development Organization
Japan Science and Technology Agency
Subject
Electrical and Electronic Engineering,Materials Chemistry,Mechanical Engineering,General Chemistry,Electronic, Optical and Magnetic Materials
Reference27 articles.
1. The Properties of Diamond;Field,1979
2. Recent advances in diamond power semiconductor devices;Umezawa;Mater. Sci. Semicond. Process.,2018
3. Doping of diamond;Kalish;Carbon,1999
4. Power Electronics Device Applications of Diamond Semiconductors;Koizumi,2018
5. Developments of elemental technologies to produce inch-size single-crystal diamond wafers;Yamada;Diam. Relat. Mater.,2011