Interfacial friction properties in diamond polishing process and its molecular dynamic analysis-Reference-Cited by-同舟云学术

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Interfacial friction properties in diamond polishing process and its molecular dynamic analysis

Published:2019-12 Issue: Volume:100 Page:107546
ISSN:0925-9635
Container-title:Diamond and Related Materials
language:en
Short-container-title:Diamond and Related Materials

Author:

Shi Zhuoying,Jin Zhuji,Guo Xiaoguang,Shi Xiaolin,Guo Jiang

Funder

Science Fund for Creative Research Groups

National Program on Key Basic Research Project

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Materials Chemistry,Mechanical Engineering,General Chemistry,Electronic, Optical and Magnetic Materials

Reference38 articles.

1. Low-pressure, metastable growth of diamond and “diamondlike” phases;Angus;Science,1988

2. Improvement of material removal rate of single-crystal diamond by polishing using H2O2 solution;Kubota;Diam. Relat. Mater.,2016

3. Chemical vapour deposition synthetic diamond: materials, technology and applications;Balmer;J. Phys. Condens. Matter,2009

4. A molecular dynamics simulation of wear mechanism of diamond tool in nanoscale cutting of copper beryllium;Sharma;Int. J. Adv. Manuf. Technol.,2019

5. UV laser polishing of thick diamond films for IR windows;Gloor;Appl. Surf. Sci.,1999

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