Mechanical damage-free surface planarization of single-crystal diamond based on carbon solid solution into nickel-Reference-Cited by-同舟云学术

Mechanical damage-free surface planarization of single-crystal diamond based on carbon solid solution into nickel

Published:2021-06 Issue: Volume:116 Page:108390
ISSN:0925-9635
Container-title:Diamond and Related Materials
language:en
Short-container-title:Diamond and Related Materials

Author:

Sakauchi Kazuto,Nagai Masatsugu,Tabakoya Taira,Nakamura Yuto,Yamasaki Satoshi,Nebel Christoph E.,Zhang Xufang,Matsumoto Tsubasa,Inokuma Takao,Tokuda Norio

Funder

JST

NEDO

Kanazawa University

Japan Society for the Promotion of Science

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Materials Chemistry,Mechanical Engineering,General Chemistry,Electronic, Optical and Magnetic Materials

Reference31 articles.

1. Single crystal diamond wafers for high power electronics;Shikata;Diam. Relat. Mater.,2016

2. Inversion channel diamond metaloxide-semiconductor field-effect transistor with normally off characteristics;Matsumoto;Sci. Rep.,2016

3. Power electronic semiconductor materials for automotive and energy saving applications – SiC, GaN, Ga2O3, and diamond;Wellmann;Z. Anorg. Allg. Chem.,2017

4. Diamond as an electronic material;Wort;Mater. Today,2008

5. Prediction of inter-particle adhesion force from surface energy and surface roughness;Jallo;J. Adhes. Sci. Technol.,2011

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fabrication of lateral diamond MOSFET with buried pn-junctions by diamond surface planarization based on carbon solid solution into nickel;Diamond and Related Materials;2024-08

2. Microstructure, Mechanical Properties, and Reinforcement Mechanism of Second-Phase Reinforced TiC-Based Composites: A Review;Coatings;2022-06-08