Carbon nanotubes for interconnects in future integrated circuits: The challenge of the density-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Carbon nanotubes for interconnects in future integrated circuits: The challenge of the density

Published:2010-05 Issue:5-6 Volume:19 Page:382-388
ISSN:0925-9635
Container-title:Diamond and Related Materials
language:en
Short-container-title:Diamond and Related Materials

Author:

Dijon Jean,Fournier Adeline,Szkutnik Pierre David,Okuno Hanako,Jayet Celine,Fayolle Murielle

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Materials Chemistry,Mechanical Engineering,General Chemistry,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. Annual ACM IEEE Design Automation Conference, Proceedings of the 44th Annual Conference on Design Automation;Naeemi,2007

2. International Technology Roadmap for Semiconductors (ITRS),2005

3. Compact physical models for multiwall carbon-nanotube interconnects

4. Carbon nanotubes — basic concepts and physical properties;Reich,2004

5. Carbon nanotubes — synthesys structure, properties, and applications;Dresselhaus,2001

Cited by 49 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Leakage current and charge transport mechanism in Poly(phenylene oxide)-Conductor Schottky bilayers;Materials Chemistry and Physics;2021-02

2. Synthesis of Vertical Carbon Nanotube Interconnect Structures Using CMOS-Compatible Catalysts;Nanomaterials;2020-09-25

3. Environmental effects, intertube interactions and σ-π bond re-hybridization in bundles of double- and triple-walled carbon nanotubes;Carbon;2020-03

4. A Finite-Element-Based Contact Resistance Model for Rough Surfaces: Applied to a Bilayered Au/MWCNT Composite;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-06

5. Rational Modification of a Metallic Substrate for CVD Growth of Carbon Nanotubes;Scientific Reports;2018-03-12

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3