Silicon-On-Diamond layer integration by wafer bonding technology-Reference-Cited by-同舟云学术

Silicon-On-Diamond layer integration by wafer bonding technology

Published:2010-07 Issue:7-9 Volume:19 Page:796-805
ISSN:0925-9635
Container-title:Diamond and Related Materials
language:en
Short-container-title:Diamond and Related Materials

Author:

Rabarot M.,Widiez J.,Saada S.,Mazellier J.-P.,Lecouvey C.,Roussin J.-C.,Dechamp J.,Bergonzo P.,Andrieu F.,Faynot O.,Deleonibus S.,Clavelier L.,Roger J.P.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Materials Chemistry,Mechanical Engineering,General Chemistry,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. Assembling the building blocks for diamond electronics;Yost,2007

2. Diamond as a unique high-tech electronic material: difficulties and prospects

3. Synthesis and characterisation of NCD films on 10 × 10 mm2and deposition on 2 inch wafer using rotating substrate-holder set-up

4. Synthesis of sub-micron diamond films on Si(100) for thermal applications by BENMPCVD;Saada,2007

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