Molecular dynamics simulation of the thermal conductivity mechanism of polydimethylsiloxane composites filled by multilayer hexagonal boron nitride-Reference-Cited by-同舟云学术

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Molecular dynamics simulation of the thermal conductivity mechanism of polydimethylsiloxane composites filled by multilayer hexagonal boron nitride

Published:2024-10 Issue: Volume:148 Page:111501
ISSN:0925-9635
Container-title:Diamond and Related Materials
language:en
Short-container-title:Diamond and Related Materials

Author:

Yang Wei,Zhen Chenxia,Tao Weihao,Shi Yanping,Luo Yanlong,Sheng Anbang,Zhu Yanqi,Wang Xiujuan

Funder

Taishan Scholar Foundation of Shandong Province

Ministry of Education

Open Fund of Key Laboratory of Sediment Research

National Aerospace Science Foundation of China

Shandong Provincial Key Laboratory of Multiphase Fluid Reaction and Separation Engineering

Publisher

Elsevier BV

Reference55 articles.

1. Research on the thermal conductivity and dielectric properties of AlN and BN co-filled addition-cure liquid silicone rubber composites;Ou;RSC Adv.,2019

2. Novel nanostructured thermal interface materials: a review;Hansson;Int. Mater. Rev.,2018

3. Thermal interface materials;Chung;J. Electron. Mater.,2020

4. Controllable synthesis of boron nitride submicron tubes and their excellent mechanical property and thermal conductivity applied in the epoxy resin polymer composites;Chen;Compos. A: Appl. Sci. Manuf.,2022

5. Understanding the thermal impedance of silicone rubber/hexagonal boron nitride composites as thermal interface materials;Ji;Chin. J. Polym. Sci.,2024

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