Author:
Park N.,Meyer F.,Lombardi F.
Subject
Hardware and Architecture,Software
Reference36 articles.
1. K.A. Stalter, R.A. Jackson, D.C. Linnell, Low-cost, high reliability flip-chip removal for multi-chip modules, Proc. Electronic Components and Technology Conf., June 1999, pp. 446–450
2. A high performance MCM-D/C application;Perfecto;IEEE Trans. CPMT, Part B: Advanced Packaging,1998
3. E.D. Perfecto, K.S. Desai, G. McAfee, Improving yields through effective diagnostics: a MCM-D/C example, Proc. Int. Conf. on Multichip Modules and High Density Packaging, April 1998, pp. 80–86
4. T. Kimura, O. Okuda, H. Ishikawa, Y. Suzuki, C.R. Hodges, P. Kim, K. Nakajima, Bare chip stacking structure for MCM production, Proc. Int. Conf. on Multichip Modules and High Density Packaging, April 1998, pp. 303–307
5. Reductions in quality causedby uneven fault coverage of different areas of an integrated circuit;Maxwell;IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems,1995
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Modeling and Evaluation of Threshold Defect Tolerance;2008 IEEE International Symposium on Defect and Fault Tolerance of VLSI Systems;2008-10
2. Timing-driven MultiChip Module routing algorithm with crosstalk consideration;Journal of Electronics (China);2006-09