1. K.-H. Becks et al., A multi chip module, the basic building block for large area pixel detectors, Proceedings of the IEEE Multi–Chip Module Conference, 1996, p. 16.
2. M. Töpper et al., Fabrication of a high–density system using BCB/Cu technology, Proceedings of the International Conference on High Density Packaging and MCMs, Denver, Colorado, April 1999.
3. K.-H. Becks et al., A MCM–D type module for the ATLAS pixel detector”, Proceedings of the IEEE Nuclear Science Symposium, Toronto, Canada, 1998.
4. K. Einsweiler et al., On the performance and limitations of a dual threshold discriminator pixel readout circuit for LHC, Proceedings of the IEEE Nuclear Science Symposium, Toronto, Canada, 1998.
5. S.I. Meuser, Pixel readout chip for the ATLAS experiment, Proceedings of the IEEE Nuclear Science Symposium, Toronto, Canada, 1998.