Chip on glass—interconnect for row/column driver packaging-Reference-Cited by-同舟云学术

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Chip on glass—interconnect for row/column driver packaging

Published:1998-06 Issue:6 Volume:29 Page:343-349
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Joshi Rajeev

Publisher

Elsevier BV

Subject

General Engineering

Reference12 articles.

1. Direct chip interconnect with adhesive connector films;Basavanhally,1992

2. Solderless COG technology using anisotropic conductive adhesives;Takakahashi,1992

3. Flip chip interconnection technology using anisotropic conductive adhesive films;Watanabe,1996

4. Role of conductive particles on anisotropic conductive films used for high density connection;Shizoawa;Hitachi Chemical Co., Technical Report,1994

Cited by 32 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Wire bonding on glass substrates via vapour deposition of Ag-Ti film;Microelectronics Journal;2019-08

2. Copper Plating on Glass Using a Solution Processed Copper-Titanium Oxide Catalytic Adhesion Layer;Journal of The Electrochemical Society;2016

3. Selective Plating on Photopatterned Titanium Oxide Films;Journal of The Electrochemical Society;2013-10-29

4. Advanced Packaging of Optoelectronic Devices;Wiley Encyclopedia of Electrical and Electronics Engineering;2013-01-18

5. Flexure mechanism-based parallelism measurements for chip-on-glass bonding;Smart Materials and Structures;2011-07-06

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