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3. Effect of Ag particle size on electrical conductive adhesives;Ye;IEEE Transactions on Electronics Packaging Manufacturing,1999
4. Chemical kinetic model of interfacial degradation of adhesive joints;Lam;IEEE Transactions on Components and Packaging,1999
5. Process induced residual stresses in isotropically conductive adhesive joints;Wu;IEEE Transactions on Components, and Manufacturing Technology-Part C,1996