Solder pastes for microelectronics-Reference-Cited by-同舟云学术

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Solder pastes for microelectronics

Published:1984-03 Issue:2 Volume:15 Page:53-64
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Anjard Ronald P.

Publisher

Elsevier BV

Subject

General Engineering

Reference5 articles.

1. Leaching of Thick Film Conductors during Solder Immersion;Anjard,1970

2. Particle Size Analyses for Powders used in Thick Film Pastes;Anjard,1982

3. Cleaning Processes for HIC's with Solder Paste;Schlough,1983

4. Solder Pastes—Trends and Advantages;Anjard;Solid State Tech.,1983

5. Trends and Advantages in Solder Paste Applications;Anjard,1983

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Vapor-phase reflow soldering ovens;Reflow Soldering;2020

2. Effect of thixotropic agents on the rheology of SnAgCu lead-free solder pastes used for jet printing;Materials Research Express;2019-02-08

3. Experimental Study of the Solder Paste Jet Printing Process Using High Speed Photography and Rheological Methods;Journal of Electronic Materials;2019-02-06

4. Rheological characterization and jet printing performance of Sn–58Bi solder pastes;Journal of Materials Science: Materials in Electronics;2017-12-13

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