1. Developments at CMP Service: from microelectronics to microsystems;Courtois,1996
2. Fabrication of novel three-dimensional microstructures by anisotropic etching of (100) and (110) silicon;Bassous;IEEE Trans. Electron. Devices,1978
3. V. Adams, R. Frank and H. Hughes, Low-cost accelerometer packaging, unpublished.
4. Pressure sensors packaged in plastic;Frank;Electronic Packaging and Production,1986
5. Bonding techniques for microsensors;Ko,1985