Highly thermally conductive flexible copper clad laminates based on sea-island structured boron nitride/polyimide composites
Author:
Funder
National Natural Science Foundation of China
Guangdong Provincial Natural Science Foundation
Publisher
Elsevier BV
Subject
General Engineering,Ceramics and Composites
Reference33 articles.
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3. Effect of thermal treatment on adhesion strength of Cu/Ni–Cr/polyimide flexible copper clad laminate fabricated by roll-to-roll process;Noh;Microelectron. Eng.,2011
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5. Enhancing the effective thermal conductivity of Kapton-type polyimide sheets via the use of hexagonal boron nitride;Haruki;Thermochim. Acta,2018
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