The combination of π-π interaction and covalent bonding can synergistically strengthen the flexible electrical insulating nanocomposites with well adhesive properties and thermal conductivity-Reference-Cited by-同舟云学术

The combination of π-π interaction and covalent bonding can synergistically strengthen the flexible electrical insulating nanocomposites with well adhesive properties and thermal conductivity

Published:2018-02 Issue: Volume:155 Page:1-10
ISSN:0266-3538
Container-title:Composites Science and Technology
language:en
Short-container-title:Composites Science and Technology

Author:

Su Zheng,Wang Hua,Tian Konghu,Huang Weiqi,Xiao Chao,Guo Yulan,He Jing,Tian Xingyou

Publisher

Elsevier BV

Subject

General Engineering,Ceramics and Composites

Reference32 articles.

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5. Anisotropic thermal diffusivity of hexagonal boron nitride-filled polyimide films: effects of filler particle size, aggregation, orientation, and polymer chain rigidity;Tanimoto;ACS Appl. Mater Interfaces,2013

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