Thermal conductivity of in situ epoxy composites filled with ZrB2 particles
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
General Engineering,Ceramics and Composites
Reference19 articles.
1. Finite element analysis of effective thermal conductivity of filled polymeric composites;Karthik;J Compos Mater,1995
2. Electrical and thermophysical properties of epoxy/aluminum nitride nanocomposites: effects of nanoparticle surface modification;Wenyi;Compos Part A,2010
3. Chemically modified boron nitride-epoxy terminated dimethylsiloxane composite for improving the thermal conductivity;Kiho;Ceram Int,2014
4. High thermal conductivity epoxy composites with bimodal distribution of aluminum nitride and boron nitride fillers;Jungpyo;Thermochim Acta,2012
5. Thermal conductivity of epoxy composites with a binary-particle system of aluminum oxide and aluminum nitride fillers;Seran;Compos Part B,2013
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