Thermally conductive PP/AlN composites with a 3-D segregated structure
Author:
Publisher
Elsevier BV
Subject
General Engineering,Ceramics and Composites
Reference32 articles.
1. Thermal conductivity of boron nitride reinforced polyethylene composites;Zhou;Mater Res Bull,2007
2. Thermal conductivity of polypropylene filled with inorganic particles;Muratov;J Alloy Compd,2013
3. Multifunctional polypropylene composites produced by incorporation of exfoliated graphite nanoplatelets;Kalaitzidou;Carbon,2007
4. Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging;Wong;J Appl Polym Sci,1999
5. Kochetov R, Andritsch T, Morshuis PHF, Smit JJ. Thermal and electrical behaviour of epoxy-based microcomposites filled with Al2O3 and SiO2 particles. In: Conference record of the 2010 IEEE International Symposium on Electrical Insulation (ISEI); 2010. p. 1–5.
Cited by 90 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Study of wear and corrosion resistance of co-deposited Ni-W–P coatings with AlN particles;Journal of Solid State Electrochemistry;2024-09-07
2. On the effective thermal conductivity of gallium-based liquid metal filled elastomers;Materials Today Communications;2024-06
3. Thermal Conduction and Solutions;Thermal Management for Opto‐electronics Packaging and Applications;2024-05-31
4. Liquid metal-modified boron nitride for polytetrafluoroethylene composites with enhanced thermal conductivity and peel strength;Composites Science and Technology;2024-05
5. Recent advancements and applications in thermally conductive polymer nanocomposites;Polymer-Plastics Technology and Materials;2024-03-29
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3