Hydrophobic PI/SiO2 composites with excellent dielectric property and thermal stability via simple modification-Reference-Cited by-同舟云学术

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Hydrophobic PI/SiO2 composites with excellent dielectric property and thermal stability via simple modification

Published:2024-04 Issue: Volume:249 Page:110508
ISSN:0266-3538
Container-title:Composites Science and Technology
language:en
Short-container-title:Composites Science and Technology

Author:

Mei Xiangyu^ORCID,Abdullaev Azim,Yang Qingbiao,Peng Kun,Shi Shuaida,Liu Fujian,Si Yinsong^ORCID,Fu Yaqin

Funder

National Natural Science Foundation of China

Zhejiang Province Natural Science Foundation

Zhejiang Sci-Tech University

Publisher

Elsevier BV

Reference48 articles.

1. The chips are down for Moore's law;Waldrop;Nature,2016

2. Low-k dielectric materials;Shamiryan;Mater. Today,2004

3. Moore's law;Edwards;Commun. ACM,2021

4. Low dielectric constant polyimide mixtures fabricated by polyimide matrix and polyimide microsphere fillers;Qiu;Polym. Int.,2020

5. Structural regulation of poly(benzoxazole imide)s and their composites with fluorinated graphene to construct high-performance low dielectric films;Yu;ACS Appl. Polym. Mater.,2022

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Polyphenylene oxide/SiO2 composites: Towards ultra-low dielectric loss and high thermal conductivity of microwave substrates;Applied Surface Science;2024-11

2. High‐performance cross‐linked SiCOH/polyimide composite film with an ultralow dielectric constant at high frequency;Journal of Applied Polymer Science;2024-07-18

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