Effect of silane-based coupling agent on the properties of silver nanoparticles filled epoxy composites

Author:

Tee D.I.,Mariatti M.,Azizan A.,See C.H.,Chong K.F.

Publisher

Elsevier BV

Subject

General Engineering,Ceramics and Composites

Reference20 articles.

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2. Development of conductive adhesives for solder replacement;Lu;IEEE Trans Comp Packaging Technol,2000

3. Recent advances on electrically conductive adhesives (ECAs);Li;IEEE Polytronic,2004

4. Toon J. Getting the lead out: alternatives to conventional solder offer new choices for electronics manufacturers, http://gtresearchnews.gatech.edu/newsrelease/, December 11; 2005.

5. Effect of nano-sized particles on the resistivity of polymeric conductive adhesives;Lee;Int J Adhes Adhes,2005

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